Invention Grant
- Patent Title: Electronic devices mounted on multiple substrates
- Patent Title (中): 安装在多个基板上的电子设备
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Application No.: US13419824Application Date: 2012-03-14
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Publication No.: US09204548B2Publication Date: 2015-12-01
- Inventor: Mudasir Ahmad , Percy Aria
- Applicant: Mudasir Ahmad , Percy Aria
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc
- Current Assignee: Cisco Technology, Inc
- Current Assignee Address: US CA San Jose
- Agency: Edell, Shapiro, Finnan, LLC
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12 ; H05K1/14 ; H05K3/34 ; H05K3/36
Abstract:
An apparatus includes a first electronic device mounted on a first substrate and a second electronic device mounted on a second substrate. In some embodiments, the second substrate is configured to be removably connected to the first electronic device. The second electronic device is mountable on either planar surface of the second substrate.
Public/Granted literature
- US20130242496A1 ELECTRONIC DEVICES MOUNTED ON MULTIPLE SUBSTRATES Public/Granted day:2013-09-19
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