Invention Grant
- Patent Title: Socket, circuit board assembly, and apparatus having the same
- Patent Title (中): 插座,电路板组件和具有该插座的装置
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Application No.: US12803723Application Date: 2010-07-02
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Publication No.: US09204549B2Publication Date: 2015-12-01
- Inventor: Hideyuki Kanno , Yoshiaki Ishiyama
- Applicant: Hideyuki Kanno , Yoshiaki Ishiyama
- Applicant Address: JP Tokyo
- Assignee: Japan Aviation Electronics Industry, Limited
- Current Assignee: Japan Aviation Electronics Industry, Limited
- Current Assignee Address: JP Tokyo
- Agency: Collard & Roe, P.C.
- Priority: JP2009-167598 20090716
- Main IPC: F21V23/06
- IPC: F21V23/06 ; H05K1/14 ; H01R13/66 ; H01R27/02 ; H05K3/36 ; F21Y101/02 ; F21Y103/00 ; H05K1/18 ; H05K3/22

Abstract:
An apparatus has a plurality of types of plugs used for different purposes and a plurality of circuit board assemblies. Each of the plurality of the circuit board assemblies includes a circuit board having a plurality of wiring portions formed thereon, an electrical and electronic part mounted on the circuit board, and a plurality of sockets attached to the circuit board and connected to the electrical and electronic part via the plurality of wiring portions. The sockets included in all of the plurality of circuit board assemblies have the same shape and are configured to receive any of the plurality of types of plugs.
Public/Granted literature
- US20110013400A1 Socket, circuit board assembly, and apparatus having the same Public/Granted day:2011-01-20
Information query