Invention Grant
- Patent Title: Heat radiation arrangement
- Patent Title (中): 散热布置
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Application No.: US14009438Application Date: 2011-07-07
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Publication No.: US09204572B2Publication Date: 2015-12-01
- Inventor: Hisao Takahashi , Satoru Anada , Toru Iwazumi
- Applicant: Hisao Takahashi , Satoru Anada , Toru Iwazumi
- Applicant Address: JP Toyota
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Toyota
- Agency: Oliff PLC
- Priority: JP2011-123475 20110601
- International Application: PCT/JP2011/065576 WO 20110707
- International Announcement: WO2012/164756 WO 20121206
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/34 ; H05B3/22 ; H01L23/40 ; H01L23/373 ; H01L23/42

Abstract:
A disclosed heat radiation arrangement includes a substrate that has a first surface on which a heating element is installed; a heat radiating member that abuts a surface of the heating element via a thermal conductive elastic member, the surface of the heating element being on an opposite side with respect to a side of the first surface; and a casing to which the substrate and the heat radiating member are attached, wherein the substrate is secured to the casing within a region between two extended sides and on opposite sides of the heating element when viewed in a direction perpendicular to the first surface, these two extended sides being defined by extending two opposite sides of the heating element, which form outer edges of the heating element, toward outer edges of the first surface.
Public/Granted literature
- US20140083994A1 HEAT RADIATION ARRANGEMENT Public/Granted day:2014-03-27
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