Invention Grant
- Patent Title: Electronic device protection
- Patent Title (中): 电子设备保护
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Application No.: US14577134Application Date: 2014-12-19
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Publication No.: US09204582B2Publication Date: 2015-12-01
- Inventor: Tai A. Lam
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Toler Law Group, PC
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H01Q15/00

Abstract:
A method includes permitting a first signal having a first electromagnetic waveform to pass through an apparatus. The method further includes blocking a second signal having a second electromagnetic waveform at the apparatus, wherein the second electromagnetic waveform is different than the first electromagnetic waveform. The apparatus includes a non-conductive substrate and a plurality of cells including conductive members coupled to the non-conductive substrate, where the conductive members are arranged to form a first discontinuous mesh, where regions between the conductive members of the first discontinuous mesh include a phase change material, and where the phase change material undergoes a phase transition from substantially non-conductive to substantially conductive.
Public/Granted literature
- US20150101860A1 ELECTRONIC DEVICE PROTECTION Public/Granted day:2015-04-16
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