Invention Grant
- Patent Title: Bi—Sn based high-temperature solder alloy
- Patent Title (中): Bi-Sn基高温焊料合金
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Application No.: US13261554Application Date: 2011-06-17
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Publication No.: US09205513B2Publication Date: 2015-12-08
- Inventor: Minoru Ueshima , Yoshimi Inagawa , Minoru Toyoda
- Applicant: Minoru Ueshima , Yoshimi Inagawa , Minoru Toyoda
- Applicant Address: JP Tokyo
- Assignee: SENJU METAL INDUSTRY CO., LTD.
- Current Assignee: SENJU METAL INDUSTRY CO., LTD.
- Current Assignee Address: JP Tokyo
- Agent Michael Tobias
- Priority: JP2010-150318 20100630
- International Application: PCT/JP2011/063894 WO 20110617
- International Announcement: WO2012/002173 WO 20120105
- Main IPC: B23K35/26
- IPC: B23K35/26 ; B23K1/00 ; C22C12/00 ; H05K3/34
Abstract:
A high-temperature solder alloy is a Bi—Sn based solder alloy containing at least 90 mass % of Bi, further containing 1-5 mass % of Sn, at least one element selected from Sb and/or Ag each in an amount of 0.5-5 mass %, and preferably further containing 0.0004-0.01 mass % of P.
Public/Granted literature
- US20130121874A1 Bi-Sn Based High-Temperature Solder Alloy Public/Granted day:2013-05-16
Information query
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