Invention Grant
- Patent Title: Film in-mold injection mold device and molding method using the same
- Patent Title (中): 膜内注射模具装置及其成型方法
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Application No.: US13741451Application Date: 2013-01-15
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Publication No.: US09205581B2Publication Date: 2015-12-08
- Inventor: Taishi Maruichi , Taro Tsujii , Hideo Mine
- Applicant: Panasonic Corporation
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: RatnerPrestia
- Priority: JP2012-029372 20120214
- Main IPC: B29C45/14
- IPC: B29C45/14

Abstract:
A film in-mold injection mold device, including: a first mold that has an injection port configured to inject a molding material; and a second mold that is configured to face the first mold and has a sucking mechanism configured to suck a film to be supplied at a time of molding, wherein the second mold has a movable protruding part configured to touch, when the film is sucked, the film before the film touches an outer periphery edge part of a concave part which is formed on the second mold depending on a shape of an article to be molded, so as to temporarily ensure a space between the outer periphery edge part and the film.
Public/Granted literature
- US20130207320A1 FILM IN-MOLD INJECTION MOLD DEVICE AND MOLDING METHOD USING THE SAME Public/Granted day:2013-08-15
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