Invention Grant
US09205698B2 Method for forming through-hole in insulating substrate by using laser beam
有权
通过使用激光束在绝缘基板上形成通孔的方法
- Patent Title: Method for forming through-hole in insulating substrate by using laser beam
- Patent Title (中): 通过使用激光束在绝缘基板上形成通孔的方法
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Application No.: US14481572Application Date: 2014-09-09
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Publication No.: US09205698B2Publication Date: 2015-12-08
- Inventor: Kohei Horiuchi
- Applicant: ASAHI GLASS COMPANY, LIMITED
- Applicant Address: JP Tokyo
- Assignee: ASAHI GLASS COMPANY, LIMITED
- Current Assignee: ASAHI GLASS COMPANY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2013-191057 20130913
- Main IPC: B44C1/22
- IPC: B44C1/22
Abstract:
A method including a) forming a through-hole in a dummy substrate including a surface by radiating a laser to the surface of the dummy substrate in a state where the dummy substrate is moved relative to the laser along a direction parallel to the surface of the dummy substrate, b) determining an angle α (−90°
Public/Granted literature
- US20150076113A1 METHOD FOR FORMING THROUGH-HOLE IN INSULATING SUBSTRATE BY USING LASER BEAM Public/Granted day:2015-03-19
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