Invention Grant
- Patent Title: Waterproof rotary contact assembly
- Patent Title (中): 防水旋转接触组件
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Application No.: US14212000Application Date: 2014-03-14
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Publication No.: US09205905B2Publication Date: 2015-12-08
- Inventor: Raymond Li
- Applicant: JLIP, LLC
- Applicant Address: US DE Wilmington
- Assignee: JLIP, LLC
- Current Assignee: JLIP, LLC
- Current Assignee Address: US DE Wilmington
- Agent Nicholas R. Lewis
- Main IPC: B63H11/08
- IPC: B63H11/08 ; H01R35/02 ; B63H11/00

Abstract:
A conduit assembly, including a first conduit segment defining a passage therethrough; a first housing affixed to the first conduit segment within the passage; a first plurality of electrical conductors attached to the first housing; a second conduit segment rotatably coupled to the first conduit segment; a second housing affixed to the second conduit; and a second plurality of electrical conductors attached to the second housing, where the second plurality of electrical conductors are in electrical communication with and rotatable about the first plurality of electrical conductors.
Public/Granted literature
- US20140273542A1 WATERPROOF ROTARY CONTACT ASSEMBLY Public/Granted day:2014-09-18
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