Invention Grant
- Patent Title: Electroconductive polyamide resin composition
- Patent Title (中): 导电聚酰胺树脂组合物
-
Application No.: US13389015Application Date: 2010-08-05
-
Publication No.: US09206048B2Publication Date: 2015-12-08
- Inventor: Ken Nakamura
- Applicant: Ken Nakamura
- Applicant Address: JP Yamaguchi
- Assignee: Ube Industries, Ltd.
- Current Assignee: Ube Industries, Ltd.
- Current Assignee Address: JP Yamaguchi
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2009-183961 20090807
- International Application: PCT/JP2010/063331 WO 20100805
- International Announcement: WO2011/016535 WO 20110210
- Main IPC: H01B1/24
- IPC: H01B1/24 ; C08G69/26 ; C08K7/04 ; C08L77/06 ; C01B31/02 ; B82Y30/00 ; B82Y40/00 ; D01F9/127

Abstract:
There is provided an electroconductive polyamide resin composition comprising: (a) a polyamide resin component obtained from a dicarboxylic acid component comprising oxalic acid and a diamine component comprising a diamine having 4 to 12 carbon atoms, and (b) a fine carbon fiber dispersed in the resin component, wherein a graphite-net plane consisting solely of carbon atoms forms a temple-bell-shaped structural unit comprising closed head-top part and body-part with open lower-end, 2 to 30 of the temple-bell-shaped structural units are stacked sharing a common central axis to form an aggregate, and the aggregates are connected in head-to-tail style with a distance to form the fiber.
Public/Granted literature
- US20120132865A1 ELECTROCONDUCTIVE POLYAMIDE RESIN COMPOSITION Public/Granted day:2012-05-31
Information query