Invention Grant
US09206310B2 Modifier for resin and resin composition using the same and formed article
有权
用于树脂和树脂组合物的改性剂使用该树脂和成型制品
- Patent Title: Modifier for resin and resin composition using the same and formed article
- Patent Title (中): 用于树脂和树脂组合物的改性剂使用该树脂和成型制品
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Application No.: US14219808Application Date: 2014-03-19
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Publication No.: US09206310B2Publication Date: 2015-12-08
- Inventor: Tsuneki Wakita , Keiji Nakamura , Hideaki Makino , Masahiro Osuka , Yohei Miwa , Yasutaka Doi
- Applicant: MITSUBISHI RAYON CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI RAYON CO., LTD.
- Current Assignee: MITSUBISHI RAYON CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-037784 20040216; JP2004-110913 20040405
- Main IPC: C08L51/00
- IPC: C08L51/00 ; C08L51/04 ; C08L63/00 ; C08F265/04 ; C08F279/02 ; C08F283/12 ; C08L33/04 ; C08L51/08 ; H01L23/29

Abstract:
A modifier for resin has an average particle size of 20 μm or more, wherein particles having an average particle size of 10 μm or less account for less than 30% by mass of the modifier, and particles having an average particle size of 10 μm or less account for 30% by mass or more of the modifier after irradiating the modifier with ultrasonic wave of 40 W for 5 minutes. Also a resin composition comprises 1 to 40% by mass of the modifier for resin and 99 to 60% by mass (the total amount of both components is 100% by mass) of a thermoplastic resin or a curable resin, and a molded article is produced by molding the same.
Public/Granted literature
- US20140206817A1 MODIFIER FOR RESIN AND RESIN COMPOSITION USING THE SAME AND FORMED ARTICLE Public/Granted day:2014-07-24
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