Invention Grant
US09206341B2 Solvent system enabling thin film deposition of epoxy adhesives for high density piezo printhead interstitial bonding
有权
溶剂系统可实现环氧树脂粘合剂的薄膜沉积，用于高密度压电印刷机间隙键合
- Patent Title: Solvent system enabling thin film deposition of epoxy adhesives for high density piezo printhead interstitial bonding
- Patent Title (中): 溶剂系统可实现环氧树脂粘合剂的薄膜沉积，用于高密度压电印刷机间隙键合
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Application No.: US14253730Application Date: 2014-04-15
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Publication No.: US09206341B2Publication Date: 2015-12-08
- Inventor: Yanjia Zuo , Mandakini Kanungo , Pratima Gattu Naga Rao , Santokh Badesha , John R. Andrews
- Applicant: XEROX CORPORATION
- Applicant Address: US CT Norwalk
- Assignee: XEROX CORPORATION
- Current Assignee: XEROX CORPORATION
- Current Assignee Address: US CT Norwalk
- Agency: Shimokaji IP
- Main IPC: B41J2/135
- IPC: B41J2/135 ; C08K5/05 ; C08K5/06 ; C09J163/00 ; C09J163/04
Abstract:
The disclosure provides a solvent system for dissolving an epoxy adhesive such as I2300L epoxy adhesive. The solvent system includes a dialkyl ether solvent and an alkyl alcohol solvent. The disclosure also provides methods for preparing a uniform thin film deposit of an epoxy adhesive for printhead interstitial bonding during their fabrication.
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