Invention Grant
- Patent Title: Electronic device case and surface treatment method thereof
- Patent Title (中): 电子设备外壳及其表面处理方法
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Application No.: US13650735Application Date: 2012-10-12
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Publication No.: US09206522B2Publication Date: 2015-12-08
- Inventor: Sung-Ho Cho , Woon-Sik Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Cha & Reiter, LLC
- Priority: KR10-2011-0104997 20111014
- Main IPC: H05K5/04
- IPC: H05K5/04 ; B21C23/24 ; C25D11/16 ; C25D11/24
Abstract:
An electronic device case and a surface treatment method thereof are provided in which an exterior case is diecast of an aluminum alloy, an aluminum alloy layer is deposited on an outer surface of the exterior case, an oxidized coating layer is formed on a surface of the aluminum alloy layer, and a sealing layer is formed atop the oxidized coating layer and may seal pores therein. A pigment colored layer may be formed between the oxidized coating layer and the sealing layer.
Public/Granted literature
- US20130093299A1 ELECTRONIC DEVICE CASE AND SURFACE TREATMENT METHOD THEREOF Public/Granted day:2013-04-18
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