Invention Grant
- Patent Title: Method and apparatus for estimating three-dimensional position and orientation through sensor fusion
- Patent Title (中): 通过传感器融合估算三维位置和方向的方法和装置
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Application No.: US13408654Application Date: 2012-02-29
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Publication No.: US09208565B2Publication Date: 2015-12-08
- Inventor: Hyong Euk Lee , Sang Hyun Kim , Chang Kyu Choi
- Applicant: Hyong Euk Lee , Sang Hyun Kim , Chang Kyu Choi
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2011-0074389 20110727
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06T7/00

Abstract:
An apparatus and method of estimating a three-dimensional (3D) position and orientation based on a sensor fusion process. The method of estimating the 3D position and orientation may include determining a position of a marker in a two-dimensional (2D) image, determining a depth of a position in a depth image corresponding to the position of the marker in the 2D image to be a depth of the marker, estimating a 3D position of the marker calculated based on the depth of the marker as a marker-based position of a remote apparatus, estimating an inertia-based position and an inertia-based orientation by receiving inertial information associated with the remote apparatus, estimating a fused position based on a weighted sum of the marker-based position and the inertia-based position, and outputting the fused position and the inertia-based orientation.
Public/Granted literature
- US20130028469A1 METHOD AND APPARATUS FOR ESTIMATING THREE-DIMENSIONAL POSITION AND ORIENTATION THROUGH SENSOR FUSION Public/Granted day:2013-01-31
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