Invention Grant
- Patent Title: Inductor structure having embedded airgap
- Patent Title (中): 具有嵌入式气隙的电感结构
-
Application No.: US14044269Application Date: 2013-10-02
-
Publication No.: US09208938B2Publication Date: 2015-12-08
- Inventor: Hanyi Ding , Anthony K. Stamper
- Applicant: International Business Machines Corporation
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Hoffman Warnick LLC
- Agent David Cain
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/30 ; H01L27/08 ; H01L21/76 ; H01F27/28 ; H01F17/00

Abstract:
Various embodiments include inductor structures including at least one air gap for reducing capacitance between windings in the inductor structure. One embodiment includes an inductor structure having: a substrate; an insulation layer overlying the substrate; a conductive winding overlying the substrate within the insulation layer, the conductive winding wrapped around itself to form a plurality of turns substantially concentric about a central axis; an insulating structural support containing an air gap between the conductive winding and the insulation layer, the insulating structural support at least one of under, over or surrounding the plurality of turns of the conductive winding or between adjacent turns in the conductive winding; and at least one insulation pocket located radially inside a radially innermost turn in the plurality of turns with respect to the central axis.
Public/Granted literature
- US20150091686A1 INDUCTOR STRUCTURE HAVING EMBEDDED AIRGAP Public/Granted day:2015-04-02
Information query