Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US14057287Application Date: 2013-10-18
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Publication No.: US09209055B2Publication Date: 2015-12-08
- Inventor: Tsutomu Hiroki
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP
- Assignee: TOKYO ELECTRONICS LIMITED
- Current Assignee: TOKYO ELECTRONICS LIMITED
- Current Assignee Address: JP
- Agency: Cantor Colburn LLP
- Priority: JP2009-212373 20090914
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67 ; B65G49/00

Abstract:
A bypass route is provided in order to transfer a substrate without passing through the atmospheric pressure transfer chamber, that is, a loader module, from a load lock chamber to a storage. In the bypass route, a sub-transfer unit for transferring the processed substrate from the load lock chamber to the storage is provided. The sub-transfer unit transfers the processed substrate from the load lock chamber to the storage, and a main transfer unit of the loader module returns the processed substrate from the storage to a transport container on holding stage.
Public/Granted literature
- US20140044505A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2014-02-13
Information query
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