Invention Grant
US09209092B2 Semiconductor device with a wide-gap semiconductor layer on inner wall of trench
有权
半导体器件在沟槽内壁上具有宽间隙半导体层
- Patent Title: Semiconductor device with a wide-gap semiconductor layer on inner wall of trench
- Patent Title (中): 半导体器件在沟槽内壁上具有宽间隙半导体层
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Application No.: US13354599Application Date: 2012-01-20
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Publication No.: US09209092B2Publication Date: 2015-12-08
- Inventor: Shunpei Yamazaki , Hiromichi Godo
- Applicant: Shunpei Yamazaki , Hiromichi Godo
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2011-014628 20110126; JP2011-112673 20110519
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/739 ; H01L29/78 ; H01L21/84 ; H01L27/06 ; H01L27/115 ; H01L27/12 ; H01L49/02 ; H01L29/423 ; H01L29/786

Abstract:
A conventional DRAM needs to be refreshed at an interval of several tens of milliseconds to hold data, which results in large power consumption. In addition, a transistor therein is frequently turned on and off; thus, deterioration of the transistor is also a problem. These problems become significant as the memory capacity increases and transistor miniaturization advances. A transistor is provided which includes a wide-gap semiconductor and has a trench structure including a trench for a gate electrode and a trench for element isolation. Even when the distance between a source electrode and a drain electrode is decreased, the occurrence of a short-channel effect can be suppressed by setting the depth of the trench for the gate electrode as appropriate.
Public/Granted literature
- US20120187475A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-07-26
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