Invention Grant
- Patent Title: Semiconductor package with lead mounted power bar
- Patent Title (中): 半导体封装带引线安装功率棒
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Application No.: US14205323Application Date: 2014-03-11
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Publication No.: US09209120B2Publication Date: 2015-12-08
- Inventor: Kong Bee Tiu , Chee Seng Foong , Wai Yew Lo
- Applicant: Kong Bee Tiu , Chee Seng Foong , Wai Yew Lo
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00
Abstract:
A semiconductor package includes a lead frame having an interior region and leads surrounding the interior region, an integrated circuit, a region of insulating material, and a power bar. The integrated circuit, which is disposed in the interior region, has bond pads and electrical couplings (e.g., bond wires) between the bond pads and the leads. The region of insulating material is disposed on at least some of the lead frame leads and the power bar is disposed on the region of insulating material. There also are electrical couplings between the power bar and at least some of the bond pads.
Public/Granted literature
- US20150262924A1 SEMICONDUCTOR PACKAGE WITH LEAD MOUNTED POWER BAR Public/Granted day:2015-09-17
Information query
IPC分类:
