Invention Grant
- Patent Title: Infrared solid-state imaging device
- Patent Title (中): 红外固态成像装置
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Application No.: US14487196Application Date: 2014-09-16
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Publication No.: US09209218B2Publication Date: 2015-12-08
- Inventor: Takahiro Onakado
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Chiyoda-ku
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-208411 20131003
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L31/072 ; H01L31/109 ; H01L31/0328 ; H01L31/0336 ; H01L27/146 ; H01L31/0304 ; H01L31/0352

Abstract:
An infrared solid-state imaging device with unit detecting sections in a matrix form, wherein the unit detecting section includes: an infrared light guiding layer; a first reflecting layer on the infrared light guiding layer; an infrared light detecting section on the first reflecting layer, the infrared light detecting section including an infrared light absorbing layer and upper and lower contact layers; and first metal wiring connected to the upper contact layer, wherein a side wall of the unit detecting section is inclined at an angle smaller than 45° to a normal direction, to form a groove between the adjacent unit detecting sections, a first insulating layer is provided on the side wall of the unit detecting section and second metal wiring is provided on the first insulating layer, and a refractive index of the first reflecting layer is lower than that of the lower contact layer.
Public/Granted literature
- US20150097157A1 INFRARED SOLID-STATE IMAGING DEVICE Public/Granted day:2015-04-09
Information query
IPC分类: