Invention Grant
- Patent Title: Method of fabricating nitride semiconductor light emitting device
- Patent Title (中): 制造氮化物半导体发光器件的方法
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Application No.: US14184171Application Date: 2014-02-19
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Publication No.: US09209349B2Publication Date: 2015-12-08
- Inventor: Kee Won Lee , Jong Uk Seo , Suk Ho Yoon , Keon Hun Lee , Sang Don Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0018649 20130221
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/00 ; H01L21/02 ; H01L33/32 ; H01L33/12 ; H01L33/16

Abstract:
A method of fabricating a nitride semiconductor light emitting device is provided. The method includes growing a first group-III-nitride semiconductor layer on a substrate, the first group-III-nitride semiconductor layer having a top surface formed as a group-III-rich surface exhibiting a group-III-polarity and a bottom surface formed as a N-rich surface exhibiting a N-polarity. The method further includes selectively etching a N-polarity region in the top surface of the first group III nitride semiconductor layer, forming a second group III nitride semiconductor layer on the first group III nitride semiconductor layer to fill the etched N-polarity region and forming a light emitting structure including first and second conductivity type nitride semiconductor layers and an active layer on the second group III nitride semiconductor layer.
Public/Granted literature
- US20140231863A1 NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND FABRICATION METHOD THEREOF Public/Granted day:2014-08-21
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