Invention Grant
US09209373B2 High power plastic leaded chip carrier with integrated metal reflector cup and direct heat sink
有权
高功率塑料引线芯片载体，集成了金属反射杯和直接散热片
- Patent Title: High power plastic leaded chip carrier with integrated metal reflector cup and direct heat sink
- Patent Title (中): 高功率塑料引线芯片载体，集成了金属反射杯和直接散热片
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Application No.: US13033520Application Date: 2011-02-23
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Publication No.: US09209373B2Publication Date: 2015-12-08
- Inventor: Keat Chuan Ng , Kheng Leng Tan , Chaiu Jin Lee
- Applicant: Keat Chuan Ng , Kheng Leng Tan , Chaiu Jin Lee
- Applicant Address: KR Seoul
- Assignee: Intellectual Discovery Co., Ltd.
- Current Assignee: Intellectual Discovery Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Fox Rothschild LLP
- Main IPC: H01L29/73
- IPC: H01L29/73 ; H01L33/64 ; H01L33/48 ; H01L33/60 ; H01L23/495
Abstract:
A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package includes a lead frame with an integrated reflector cup. The reflector cup is directly connected to a heat sink, which improves the ability of the PLCC package to distribute heat away from the light source that is provided in the reflector cup.
Public/Granted literature
- US20120211785A1 HIGH POWER PLASTIC LEADED CHIP CARRIER WITH INTEGRATED METAL REFLECTOR CUP AND DIRECT HEAT SINK Public/Granted day:2012-08-23
Information query
IPC分类:
