Invention Grant
- Patent Title: Wireless power supply system and multi-layer shim assembly
- Patent Title (中): 无线供电系统和多层垫片组装
-
Application No.: US13217565Application Date: 2011-08-25
-
Publication No.: US09209627B2Publication Date: 2015-12-08
- Inventor: David W. Baarman , William T. Stoner, Jr. , Benjamin C. Moes , Joseph C. Van Den Brink , Joshua K. Schwannecke , Neil W. Kuyvenhoven
- Applicant: David W. Baarman , William T. Stoner, Jr. , Benjamin C. Moes , Joseph C. Van Den Brink , Joshua K. Schwannecke , Neil W. Kuyvenhoven
- Applicant Address: US MI Ada
- Assignee: ACCESS BUSINESS GROUP INTERNATIONAL LLC
- Current Assignee: ACCESS BUSINESS GROUP INTERNATIONAL LLC
- Current Assignee Address: US MI Ada
- Agency: Warner Norcross & Judd LLP
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F5/00 ; H02J5/00 ; H01F17/00 ; H01F27/02 ; H01F27/04 ; H01F38/14 ; H02J7/02 ; H02J17/00

Abstract:
A wireless power supply includes a multi-layer shim assembly. Each shim aids in alignment of coils and routing of conductors in a multi-layer coil array. A shield or PCB can be used as part of the multi-layer shim assembly. Wires can be routed through channels to the edge of the shim assembly or wires can protrude through a portion of the multi-layer shim assembly. Traces can be used to route current through the multi-layer shim assembly. Plastic shims can be created by over-molding coils with plastic.
Public/Granted literature
- US20120049991A1 WIRELESS POWER SUPPLY SYSTEM AND MULTI-LAYER SHIM ASSEMBLY Public/Granted day:2012-03-01
Information query