Invention Grant
- Patent Title: Power supply circuit and heat pump unit
- Patent Title (中): 电源电路和热泵单元
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Application No.: US14001179Application Date: 2011-12-19
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Publication No.: US09209705B2Publication Date: 2015-12-08
- Inventor: Nobuyoshi Takata
- Applicant: Nobuyoshi Takata
- Applicant Address: JP Osaka
- Assignee: Daikin Industries, Ltd.
- Current Assignee: Daikin Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2011-039962 20110225
- International Application: PCT/JP2011/079309 WO 20111219
- International Announcement: WO2012/114626 WO 20120830
- Main IPC: H02M7/06
- IPC: H02M7/06 ; H02J1/10 ; H02M7/08

Abstract:
A first conversion section converts, into a first direct-current voltage, an alternating-current voltage input from input lines, and applies the same between power supply lines. A diode is arranged between the power supply lines such that an anode thereof faces toward the power supply line side. A capacitor has both ends connected to a direct-current load, and is connected in series with the diode. A switch section selects conduction/non-conduction between an alternating-current power supply and the first conversion section. A second conversion section converts, into a second direct-current voltage, the alternating-current voltage input without passing through the switch section, and is connected to a connection point located between the capacitor and the diode to apply the second direct-current voltage to the capacitor.
Public/Granted literature
- US20130333861A1 POWER SUPPLY CIRCUIT AND HEAT PUMP UNIT Public/Granted day:2013-12-19
Information query
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