Invention Grant
- Patent Title: Microelectromechanical resonators
- Patent Title (中): 微机电谐振器
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Application No.: US13834486Application Date: 2013-03-15
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Publication No.: US09209778B2Publication Date: 2015-12-08
- Inventor: Thoralf Kautzsch , Heiko Froehlich , Mirko Vogt , Maik Stegemann , Thomas Santa , Markus Burian
- Applicant: Infineon Technologies Dresden GmbH
- Applicant Address: DE Dresden
- Assignee: Infineon Technologies Dresden GmbH
- Current Assignee: Infineon Technologies Dresden GmbH
- Current Assignee Address: DE Dresden
- Agency: Schiff Hardin LLP
- Main IPC: H03H9/24
- IPC: H03H9/24 ; H03H9/02 ; B81B3/00 ; B81C1/00 ; H03H3/007

Abstract:
Embodiments relate to MEMS resonator structures and methods that enable application of a maximum available on-chip voltage. In an embodiment, a MEMS resonator comprises a connection between a ground potential and the gap electrode of the resonator. Embodiments also relate to manufacturing systems and methods that are less complex and enable production of MEMS resonators of reduced dimensions.
Public/Granted literature
- US20140266484A1 MICROELECTROMECHANICAL RESONATORS Public/Granted day:2014-09-18
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