Invention Grant
- Patent Title: Power supply apparatus
- Patent Title (中): 电源设备
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Application No.: US13001454Application Date: 2009-06-17
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Publication No.: US09210788B2Publication Date: 2015-12-08
- Inventor: Shinobu Matsubara , Yoshikuni Horishita , Hidenori Yoda , Yoshio Yanagiya , Takeo Toda
- Applicant: Shinobu Matsubara , Yoshikuni Horishita , Hidenori Yoda , Yoshio Yanagiya , Takeo Toda
- Applicant Address: JP Kanagawa
- Assignee: ULVAC, INC.
- Current Assignee: ULVAC, INC.
- Current Assignee Address: JP Kanagawa
- Agency: Cermak Nakajima & McGowan LLP
- Agent Tomoko Nakajima
- Priority: JP2008-170806 20080630
- International Application: PCT/JP2009/060988 WO 20090617
- International Announcement: WO2010/001723 WO 20100107
- Main IPC: C23C14/34
- IPC: C23C14/34 ; H05H1/46 ; C23C14/54 ; H01J37/34 ; H03H7/40

Abstract:
There is provided a power supply apparatus which is easy in attempting to unify the thickness distribution of a thin film to be formed on the surface of a substrate even at the time of charging pulsed potential at a low frequency to targets that make respective pairs. The power supply apparatus of this invention has: a first discharge circuit which alternately charges predetermined potential to a pair of targets that are in contact with a plasma at a predetermined frequency; and a second discharge circuit which charges predetermined potential between the ground and the target, out of the pair of targets, that is not receiving output from the first discharge circuit.
Public/Granted literature
- US20110100807A1 POWER SUPPLY APPARATUS Public/Granted day:2011-05-05
Information query
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