Invention Grant
- Patent Title: Mobile terminal having board support structure
- Patent Title (中): 具有电路板支撑结构的移动终端
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Application No.: US14005159Application Date: 2012-03-05
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Publication No.: US09210823B2Publication Date: 2015-12-08
- Inventor: Tatsuo Sawada , Hiroki Tanaka
- Applicant: Tatsuo Sawada , Hiroki Tanaka
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Dickinson Wright PLLC
- Priority: JP2011-056063 20110315
- International Application: PCT/JP2012/001504 WO 20120305
- International Announcement: WO2012/124286 WO 20120920
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K7/02 ; H04M1/18 ; H04M1/02

Abstract:
To provide a mobile terminal having a board support structure capable of reducing impact on built-in components of the mobile terminal when a housing thereof undergoes a primary mode of deformation.The upper end portion and the lower end portion of a main board 40 are supported by bosses 111a, 111b, 113a, and 113b. The upper end portion and the lower end portion of the main board 40 are fixed in a direction perpendicular to the surface of the main board 40. The upper end portion thereof slides with respect to the peripheries of small-diameter cylindrical portion insertion holes 211a and 211b of a module holding board 30 on the front side and a rear housing 20 on the rear side. Thus, the main board 40 can move in a plane direction (in a longitudinal direction).
Public/Granted literature
- US20140003003A1 MOBILE TERMINAL HAVING BOARD SUPPORT STRUCTURE Public/Granted day:2014-01-02
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