Invention Grant
- Patent Title: Electronic component mounting device
- Patent Title (中): 电子元件安装装置
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Application No.: US13868413Application Date: 2013-04-23
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Publication No.: US09210836B2Publication Date: 2015-12-08
- Inventor: Yoshitada Higashizawa , Kosuke Kobayashi , Yukinori Hatayama
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2012-104343 20120501
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/04 ; H05K13/00 ; H01L23/00 ; H05K3/34 ; B23K1/00 ; B23K1/20 ; B23K3/08 ; H01L21/56
Abstract:
An electronic component mounting device, includes a stage in which a plurality of stage portions are defined, a first heater provided in the plurality of stage portions respectively, and the first heater which can be controlled independently, a mounting head arranged over the stage, and a second heater provided in the mounting head.
Public/Granted literature
- US20130291378A1 METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT MOUNTING DEVICE Public/Granted day:2013-11-07
Information query
