Invention Grant
- Patent Title: Support mechanism for a heat exchanger in an air-conditioning system
- Patent Title (中): 空调系统中热交换器的支撑机构
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Application No.: US13887728Application Date: 2013-05-06
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Publication No.: US09212852B2Publication Date: 2015-12-15
- Inventor: Junhyeon Hwang , Hongseok Choi , Changhwan Cho
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates LLP
- Priority: KR10-2012-0075633 20120711
- Main IPC: F28F9/00
- IPC: F28F9/00 ; F28F1/00 ; F28D7/02

Abstract:
A heat exchanger is provided that may include a shell; a first pipe that guides a first fluid into the shell; a tube, through which a second fluid that exchanges heat with the first fluid may pass; a second pipe, through which the first fluid is guided outside of the shell; and a base including a fastening portion to which the shell may be fastened and a support portion that supports the fastening portion. The fastening portion may have a tube hole, through which the tube may pass, and a pipe hole, through which at least one of the first pipe or the second pipe may pass, so that it is possible to increase availability of space at a side of and above the shell, and at least one of the first pipe, the second pipe, or the tube may be protected by the base, resulting in high reliability.
Public/Granted literature
- US20140014300A1 HEAT EXCHANGER Public/Granted day:2014-01-16
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