Invention Grant
- Patent Title: Three-dimensional nonvolatile memory and method of fabrication
- Patent Title (中): 三维非易失性存储器及其制造方法
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Application No.: US14270409Application Date: 2014-05-06
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Publication No.: US09214243B2Publication Date: 2015-12-15
- Inventor: Mark G. Johnson , Thomas H. Lee , Vivek Subramanian , Paul Michael Farmwald , James M. Cleeves
- Applicant: SanDisk 3D LLC
- Applicant Address: US CA Milpitas
- Assignee: SanDisk 3D LLC
- Current Assignee: SanDisk 3D LLC
- Current Assignee Address: US CA Milpitas
- Agency: Vierra Magen Marcus LLP
- Main IPC: G11C11/36
- IPC: G11C11/36 ; G11C17/06 ; G11C11/56 ; G11C13/00 ; G11C17/14 ; G11C17/16 ; H01L27/10 ; H01L27/102 ; H01L45/00 ; H01L27/24

Abstract:
A three-dimensional memory is provided that includes a first memory level and a second memory level monolithically formed above the first memory level. The first memory level includes a first steering element coupled in series with and vertically stacked above or below a first non-volatile state change element. The second memory level includes a second steering element coupled in series with and vertically stacked above or below a second non-volatile state change element. Other aspects are also provided.
Public/Granted literature
- US20140239248A1 THREE-DIMENSIONAL NONVOLATILE MEMORY AND METHOD OF FABRICATION Public/Granted day:2014-08-28
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