Invention Grant
- Patent Title: Aluminum alloy conductor
- Patent Title (中): 铝合金导体
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Application No.: US13594419Application Date: 2012-08-24
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Publication No.: US09214251B2Publication Date: 2015-12-15
- Inventor: Shigeki Sekiya , Kuniteru Mihara , Kyota Susai
- Applicant: Shigeki Sekiya , Kuniteru Mihara , Kyota Susai
- Applicant Address: JP Tokyo JP Shiga
- Assignee: FURUKAWA ELECTRIC CO., LTD.,FURUKAWA AUTOMOTIVE SYSTEMS INC.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.,FURUKAWA AUTOMOTIVE SYSTEMS INC.
- Current Assignee Address: JP Tokyo JP Shiga
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2010-043487 20100226
- Main IPC: H01B1/02
- IPC: H01B1/02 ; C22C21/00 ; C22F1/00 ; C22F1/04

Abstract:
An aluminum alloy conductor, containing: 0.01 to 0.4 mass % of Fe, 0.1 to 0.3 mass % of Mg, 0.04 to 0.3 mass % of Si, 0.1 to 0.5 mass % of Cu, and 0.001 to 0.01 mass % of Ti and V in total, with the balance being Al and inevitable impurities,wherein the conductor contains three kinds of intermetallic compounds A, B, and C, in which the intermetallic compounds A, B, and C have a particle size of 0.1 μm or more but 2 μm or less, 0.03 μm or more but less than 0.1 μm, and 0.001 μm or more but less than 0.03 μm, respectively, and area ratios a, b, and c of the intermetallic compounds A, B, and C, in an arbitrary region in the conductor, satisfy: 0.1%≦a≦2.5%, 0.1%≦b≦3%, and 1%≦c≦10%.
Public/Granted literature
- US20120321889A1 ALUMINUM ALLOY CONDUCTOR Public/Granted day:2012-12-20
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