Invention Grant
- Patent Title: Very thin dielectrics for high permittivity and very low leakage capacitors and energy storing devices
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Application No.: US14490892Application Date: 2014-09-19
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Publication No.: US09214281B2Publication Date: 2015-12-15
- Inventor: David R. Carver , Robert G. Carver
- Applicant: Carver Scientific, Inc.
- Applicant Address: US LA Baton Rouge
- Assignee: Carver Scientific, Inc.
- Current Assignee: Carver Scientific, Inc.
- Current Assignee Address: US LA Baton Rouge
- Agency: Klarquist Sparkman, LLP
- Main IPC: H01G4/18
- IPC: H01G4/18 ; H01G13/00 ; H01G4/018 ; H01G4/04 ; H01G4/20

Abstract:
Methods are disclosed for creating extremely high permittivity dielectric materials for use in capacitors and energy storage devices. High permittivity materials suspended in an organic non-conductive media matrix with enhanced properties and methods for making the same are disclosed. Organic polymers, shellac, silicone oil, and/or zein formulations are utilized to produce thin film low conductivity dielectric coatings. Transition metal salts as salt or oxide matrices are formed at low temperatures utilizing mild reducing agents.
Public/Granted literature
- US20150000833A1 VERY THIN DIELECTRICS FOR HIGH PERMITTIVITY AND VERY LOW LEAKAGE CAPACITORS AND ENERGY STORING DEVICES Public/Granted day:2015-01-01
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