Invention Grant
- Patent Title: Composite dielectric materials with improved mechanical and electrical properties
- Patent Title (中): 复合介电材料具有改善的机械和电气性能
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Application No.: US14220288Application Date: 2014-03-20
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Publication No.: US09214332B2Publication Date: 2015-12-15
- Inventor: Donald F. Canaperi , Alfred Grill , Son V. Nguyen , Deepika Priyadarshini , Hosadurga Shobha
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Steven J. Meyers, Esq.
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/02
Abstract:
A low k dielectric material with enhanced electrical and mechanical properties is provided which, in some applications, can also reduce the capacitance of a semiconductor device. The low k dielectric material includes CNT nanotubes that are randomly dispersed within a low k dielectric material matrix. The low k dielectric material can be used in a variety of electronic devices including, for example, as an insulator layer within a back end of line interconnect structure.
Public/Granted literature
- US20150270124A1 COMPOSITE DIELECTRIC MATERIALS WITH IMPROVED MECHANICAL AND ELECTRICAL PROPERTIES Public/Granted day:2015-09-24
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