Invention Grant
- Patent Title: Substrate cleaning apparatus and vacuum processing system
- Patent Title (中): 基板清洗装置和真空处理系统
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Application No.: US13429720Application Date: 2012-03-26
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Publication No.: US09214364B2Publication Date: 2015-12-15
- Inventor: Kazuya Dobashi , Kensuke Inai , Akitaka Shimizu , Kenta Yasuda , Yu Yoshino , Toshihiro Aida , Takehiko Senoo
- Applicant: Kazuya Dobashi , Kensuke Inai , Akitaka Shimizu , Kenta Yasuda , Yu Yoshino , Toshihiro Aida , Takehiko Senoo
- Applicant Address: JP Tokyo JP Osaka-shi
- Assignee: TOKYO ELECTRON LIMITED,IWATANI CORPORATION
- Current Assignee: TOKYO ELECTRON LIMITED,IWATANI CORPORATION
- Current Assignee Address: JP Tokyo JP Osaka-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P
- Priority: JP2011-080098 20110331
- Main IPC: H01L21/67
- IPC: H01L21/67 ; C23C16/455 ; H01J37/32
Abstract:
A substrate cleaning apparatus includes a supporting unit, provided in a processing chamber having a gas exhaust port, for supporting a substrate; one or more nozzle units, each for ejecting gas clusters to a peripheral portion of the substrate supported by the supporting unit to remove unnecessary substances from the peripheral portion; and a moving mechanism for changing relative positions of the supporting unit and the nozzle unit during ejecting the gas clusters. Each nozzle unit discharges a cleaning gas having a pressure higher than that in the processing chamber so that the cleaning gas is adiabatically expanded to form aggregates of atoms and/or molecules.
Public/Granted literature
- US20120247670A1 SUBSTRATE CLEANING APPARATUS AND VACUUM PROCESSING SYSTEM Public/Granted day:2012-10-04
Information query
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