A fluid cooled thermal management technique for a high-density composite focal plane array (CPFA) is disclosed. In one embodiment, a high density CFPA assembly includes a plurality of imaging dies mounted on a front surface of a printed wiring board (PWB) and a base plate. The base plate has a substantially matched coefficient of thermal expansion (CTE) to that of the high density CFPA. Further, the high density CFPA is disposed on a front side of the base plate. Furthermore, the base plate has a plurality of integral serpentine fluid flow channels configured to receive and circulate fluid and further configured such that the heat generated by the CFPA is transferred via conduction into the base plate and to the integral serpentine fluid flow channels and to the circulating fluid to dissipate the generated heat.