Invention Grant
US09214956B2 Semiconductor device, multichip package and semiconductor system using the same
有权
半导体器件，多芯片封装和半导体系统使用相同
- Patent Title: Semiconductor device, multichip package and semiconductor system using the same
- Patent Title (中): 半导体器件，多芯片封装和半导体系统使用相同
-
Application No.: US14085436Application Date: 2013-11-20
-
Publication No.: US09214956B2Publication Date: 2015-12-15
- Inventor: Sung-Hwa Ok
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2013-0070379 20130619
- Main IPC: G06F11/10
- IPC: G06F11/10 ; H03M13/00 ; H03M13/09 ; G11C29/04
Abstract:
A semiconductor device includes an error detection unit suitable for receiving data and a cyclic redundancy check (CRC) code, and for outputting a detection signal by detecting a transmission error of the data, and a signal change unit suitable for generating error information based on the detection signal while changing a signal form of the error information based on a signal transmission environment of the data.
Public/Granted literature
- US20140380136A1 SEMICONDUCTOR DEVICE, MULTICHIP PACKAGE AND SEMICONDUCTOR SYSTEM USING THE SAME Public/Granted day:2014-12-25
Information query
