Invention Grant
- Patent Title: Via structure for transmitting differential signals
- Patent Title (中): 通过差分信号传输结构
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Application No.: US13607298Application Date: 2012-09-07
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Publication No.: US09215795B2Publication Date: 2015-12-15
- Inventor: Gary Ellsworth Biddle , James Nadolny
- Applicant: Gary Ellsworth Biddle , James Nadolny
- Applicant Address: US IN New Albany
- Assignee: SAMTEC, INC.
- Current Assignee: SAMTEC, INC.
- Current Assignee Address: US IN New Albany
- Agency: Keating & Bennett, LLP
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02 ; H05K3/40
Abstract:
An electrical system including (1) a printed circuit board including first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, a first signal trace located on the top surface of the printed circuit board and connecting the first signal pad and the first signal via, and a second signal trace located on the top surface of the printed circuit board and connecting the second signal pad and the second signal via; and (2) a connector including first and second signal contacts arranged to transmit the first differential signal. The first differential signal transmitted through the printed circuit board and the connector has a common central axis.
Public/Granted literature
- US20130056254A1 VIA STRUCTURE FOR TRANSMITTING DIFFERENTIAL SIGNALS Public/Granted day:2013-03-07
Information query
