Invention Grant
- Patent Title: Electronic device with heat dissipating electromagnetic interference shielding structures
- Patent Title (中): 具有散热电磁干扰屏蔽结构的电子装置
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Application No.: US13839903Application Date: 2013-03-15
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Publication No.: US09215833B2Publication Date: 2015-12-15
- Inventor: Dominic E. Dolci , Phillip S. Satterfield , Vikas K. Sinha
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group
- Agent G. Victor Treyz
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K9/00 ; H05K1/02

Abstract:
An electronic device may have a metal electromagnetic interference shielding enclosure. The enclosure may have a bottom wall, vertical sidewalls that extend upwards from the bottom wall, and a lid that covers the enclosure to define an interior cavity. Power supply components and other electrical components may be mounted within the interior cavity. A printed circuit board on which integrated circuits and other components are mounted may have an upper surface that faces the bottom wall of the enclosure and an opposing lower surface that faces a metal plate. Fence structures may be used to help shield components mounted on the printed circuit. Heat may be dissipated from components on the printed circuit into the bottom wall and into the metal plate. A plastic housing may be used to house the shielding enclosure, printed circuit board, components mounted on the printed circuit board, and the metal plate.
Public/Granted literature
- US20140268578A1 Electronic Device With Heat Dissipating Electromagnetic Interference Shielding Structures Public/Granted day:2014-09-18
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