The tag comprises a bearing substrate, a first adhesive layer, a resin film, an etching antenna layer, a chip, a first insulating layer, a conductive circuit layer, a second adhesive layer, and a pattern-bearing layer. The resin film is disposed between the bearing substrate and the etching antenna layer. The etching antenna layer is etched by copper foil or aluminum foil. The conductive circuit layer and the etching antenna layer are combined to construct a compound high-frequency antenna of the fragile RFID electronic tag. The conductive circuit layer fulfills a communication of a jumper wire on the etching antenna layer. The first insulating layer is disposed between the conductive circuit layer and the etching antenna layer. The chip is connected to the etching antenna layer. The etching antenna layer, the conductive circuit layer, the first insulating layer and the chip are combined to construct a core assembly. The pattern-bearing layer is adhered to the other side of the core assembly via the second adhesive layer.