Invention Grant
- Patent Title: Multilayer ceramic capacitor, manufacturing method of the same, and circuit board with multilayer ceramic capacitor mounted thereon
- Patent Title (中): 多层陶瓷电容器及其制造方法以及安装有多层陶瓷电容器的电路板
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Application No.: US13781411Application Date: 2013-02-28
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Publication No.: US09218910B2Publication Date: 2015-12-22
- Inventor: Jun Hee Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0151019 20121221
- Main IPC: H01G4/35
- IPC: H01G4/35 ; H01G4/30 ; H01G4/008 ; H01G4/012 ; H01G4/232 ; H05K3/34

Abstract:
There is provided a multilayer ceramic capacitor including: a ceramic body including a dielectric layer; a first internal electrode having a first non-pattern portion and a first pattern portion having one end exposed to one or more of surfaces of the ceramic body; a second internal electrode having an overlap region with the first pattern portion with the dielectric layer interposed therebetween and having a second non-pattern portion and a second pattern portion having one end exposed to one or more of surfaces of the ceramic body; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively, wherein the first and second pattern portions have a metal oxide region having a predetermined width from an exposed end portion of a region thereof not connected to the first or the second external electrode, among exposed end portions, toward a central portion thereof, respectively.
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