Invention Grant
- Patent Title: Aerogel dielectric layer
- Patent Title (中): 气凝胶介电层
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Application No.: US13200477Application Date: 2011-09-23
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Publication No.: US09218989B2Publication Date: 2015-12-22
- Inventor: Mark S. Hauhe , Jason G. Milne , Terry C. Cisco , Paul Nahass , George Gould , Nick Zafiropoulos
- Applicant: Mark S. Hauhe , Jason G. Milne , Terry C. Cisco , Paul Nahass , George Gould , Nick Zafiropoulos
- Applicant Address: US MA Waltham US MA Northborough
- Assignee: RAYTHEON COMPANY,ASPEN AEROGELS, INC.
- Current Assignee: RAYTHEON COMPANY,ASPEN AEROGELS, INC.
- Current Assignee Address: US MA Waltham US MA Northborough
- Agency: Christie, Parker & Hale, LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/29
Abstract:
A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0 or less and a compression strength of at least approximately 100 psi.
Public/Granted literature
- US20130075795A1 Aerogel dielectric layer Public/Granted day:2013-03-28
Information query
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