Invention Grant
- Patent Title: Integrated circuit packaging system with terminals and method of manufacture thereof
- Patent Title (中): 具有端子的集成电路封装系统及其制造方法
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Application No.: US13326806Application Date: 2011-12-15
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Publication No.: US09219029B2Publication Date: 2015-12-22
- Inventor: Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- Applicant: Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L23/495 ; H01L23/498 ; H01L21/48 ; H01L23/31 ; H01L23/00
Abstract:
A method of manufacture of an integrated circuit packaging system includes: forming a lead having a lead top side; forming a lower interior conductive layer directly on the lead top side; forming an interior insulation layer directly on the lower interior conductive layer; forming an upper interior conductive layer directly on the interior insulation layer; and mounting an integrated circuit over the upper interior conductive layer.
Public/Granted literature
- US20130154119A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINALS AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2013-06-20
Information query
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