Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13758359Application Date: 2013-02-04
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Publication No.: US09219042B2Publication Date: 2015-12-22
- Inventor: Jong Sik Paek , Doo Hyun Park
- Applicant: Jong Sik Paek , Doo Hyun Park
- Applicant Address: US AZ Tempe
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR10-2012-0129646 20121115
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/00 ; H01L21/683 ; H01L25/065 ; H01L25/00 ; H01L23/31 ; H01L21/56
Abstract:
Provided are a semiconductor device and a method of manufacturing the same. A carrier is removed after a first semiconductor die and a second semiconductor die are stacked on each other, and then a first encapsulant is formed, so that the carrier may be easily removed when compared to approaches in which a carrier is removed from a wafer having a thin thickness.
Public/Granted literature
- US20140131886A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-05-15
Information query
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