Invention Grant
US09219044B2 Patterned photoresist to attach a carrier wafer to a silicon device wafer
有权
图案化的光致抗蚀剂将载体晶片附着到硅器件晶片
- Patent Title: Patterned photoresist to attach a carrier wafer to a silicon device wafer
- Patent Title (中): 图案化的光致抗蚀剂将载体晶片附着到硅器件晶片
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Application No.: US14083352Application Date: 2013-11-18
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Publication No.: US09219044B2Publication Date: 2015-12-22
- Inventor: Chin Hock Toh , Aksel Kitowski , Uday Mahajan , Thean Ming Tan
- Applicant: Chin Hock Toh , Aksel Kitowski , Uday Mahajan , Thean Ming Tan
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/00 ; H01L21/46 ; H01L21/44 ; H01L23/00
Abstract:
Patterned photoresist is used to attach a carrier wafer to a silicon device wafer. In one example, a silicon wafer is patterned for contact bumps by applying a photoresist over a surface of the wafer and removing the photoresist in locations at which the contact bumps are to be formed. The contact bumps are formed in the locations at which the photoresist is removed. A temporary carrier is attached to the photoresist over the wafer. The back side of the wafer opposite the contact bumps is processed while handling the wafer using the temporary carrier. The temporary carrier is removed. The photoresist on the front side of the wafer with the contact bumps is removed after removing the temporary carrier.
Public/Granted literature
- US20150140801A1 PATTERNED PHOTORESIST TO ATTACH A CARRIER WAFER TO A SILICON DEVICE WAFER Public/Granted day:2015-05-21
Information query
IPC分类:
