Invention Grant
- Patent Title: Making a flip-chip assembly with bond fingers
- Patent Title (中): 用键合手指进行倒装芯片组装
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Application No.: US14278264Application Date: 2014-05-15
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Publication No.: US09219052B2Publication Date: 2015-12-22
- Inventor: Raymond Maldan Partosa , Jesus Bajo Bautista , James Raymond Baello , Roxanna Bauzon Samson
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Frank D. Cimino
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L23/498
Abstract:
A method of making a flip chip assembly includes a substrate having a top surface and forming a plurality of generally longitudinally extending, laterally spaced apart bond fingers are formed on the top surface. Each of the plurality of bond fingers has a first longitudinal end portion and a second longitudinal end portion. Applying a transversely extending solder resist strip over the first longitudinal end portions of the bond fingers. The strip has an edge wall with a plurality of longitudinally projecting tooth portions separated by gaps. Each tooth portion and each gap aligned with a different one of the bond fingers in each adjacent pair of bond fingers.
Public/Granted literature
- US20140248746A1 MAKING A FLIP-CHIP ASSEMBLY WITH BOND FINGERS Public/Granted day:2014-09-04
Information query
IPC分类:
