Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14061427Application Date: 2013-10-23
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Publication No.: US09219161B2Publication Date: 2015-12-22
- Inventor: Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2012-234359 20121024
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/12 ; H01L29/786 ; H01L29/423 ; H01L29/66

Abstract:
A semiconductor device having a structure which can prevent a decrease in electrical characteristics, which becomes more significant with miniaturization of a transistor, is provided. In addition, a highly reliable semiconductor device is provided. The semiconductor device includes a first gate electrode layer, a second gate electrode layer, and a third gate electrode layer, which are each provided separately. The first gate electrode layer overlaps with an oxide semiconductor layer. The second gate electrode layer partly covers one end portion of the oxide semiconductor layer in the channel width direction. The third gate electrode layer partly covers the other end portion of the oxide semiconductor layer in the channel width direction.
Public/Granted literature
- US20140110706A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-04-24
Information query
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