Invention Grant
- Patent Title: Resonator, multilayer board and electronic device
- Patent Title (中): 谐振器,多层板和电子设备
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Application No.: US13972172Application Date: 2013-08-21
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Publication No.: US09219299B2Publication Date: 2015-12-22
- Inventor: Koichi Kondo , Naoharu Yamamoto , Yoshitaka Toyota , Kengo Iokibe , Farhan Zaheed Mahmood
- Applicant: NEC TOKIN CORPORATION , NATIONAL UNIVERSITY CORPORATION OKAYAMA UNIVERSITY
- Applicant Address: JP Sendai-Shi, Miyagi JP Okayama-Shi, Okayama
- Assignee: NEC TOKIN CORPORATION,NATIONAL UNIVERSITY CORPORATION OKAYAMA UNIVERSITY
- Current Assignee: NEC TOKIN CORPORATION,NATIONAL UNIVERSITY CORPORATION OKAYAMA UNIVERSITY
- Current Assignee Address: JP Sendai-Shi, Miyagi JP Okayama-Shi, Okayama
- Agency: Holtz, Holtz, Goodman & Chick PC
- Priority: JP2012-186548 20120827; JP2013-082762 20130411
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H01P7/10 ; H01P1/20 ; H01P1/203 ; H01P7/08

Abstract:
A resonator is connected to a first plane which is one of a power plane and a ground plane, wherein the power plane and the ground plane are apart from each other in an up-down direction. The resonator comprises a connecting portion and a body portion. The connecting portion is connected to the first plane. The connecting portion extends in the up-down direction beyond a second plane, which is a remaining one of the power plane and the ground plane, while not being in electrical contact with the second plane. The body portion is connected to the connecting portion while not being in contact with the second plane. The body portion is arranged so that the second plane is located between the body portion and the first plane in the up-down direction.
Public/Granted literature
- US20140055208A1 RESONATOR, MULTILAYER BOARD AND ELECTRONIC DEVICE Public/Granted day:2014-02-27
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