Invention Grant
- Patent Title: Anti-deformation low profile card edge connector
- Patent Title (中): 防变形低档卡边缘连接器
-
Application No.: US14505665Application Date: 2014-10-03
-
Publication No.: US09219321B2Publication Date: 2015-12-22
- Inventor: Kuan-Wu Chen , Hsing-Yu Lee
- Applicant: BELLWETHER ELECTRONIC CORP. , BELLWETHER ELECTRONIC (KUNSHAN) CORP.
- Applicant Address: TW Taoyuan County CN Kunshan, JS
- Assignee: BELLWETHER ELECTRONIC CORP.,BELLWETHER ELECTRONIC (KUNSHAN) CORP.
- Current Assignee: BELLWETHER ELECTRONIC CORP.,BELLWETHER ELECTRONIC (KUNSHAN) CORP.
- Current Assignee Address: TW Taoyuan County CN Kunshan, JS
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Priority: TW102223075U 20131209
- Main IPC: H01R24/00
- IPC: H01R24/00 ; H01R12/72

Abstract:
An anti-deformation low profile card edge connector includes an insulation body having a transverse elongated shape and a plurality of terminals. The insulation body has a top portion and a bottom portion forming along a transverse direction of the insulation body. An insertion slot is indentedly formed between the top portion and the bottom portion. The bottom portion is connected to a terminal base protruding further out than the top portion. Each terminal is respectively arranged on the terminal base to insert into the insertion slot. The insulation body and the terminal base are connected in such a manner that a space is reserved between them, and thereby the even contact between each terminal and the circuit board is not affected by deformation during a process of welding the card edge connector and a circuit board together.
Public/Granted literature
- US20150162682A1 ANTI-DEFORMATION LOW PROFILE CARD EDGE CONNECTOR Public/Granted day:2015-06-11
Information query