Invention Grant
- Patent Title: Temperature compensated bulk acoustic wave devices using over-moded acoustic reflector layers
- Patent Title (中): 温度补偿的体声波器件使用过调式反射层
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Application No.: US14044782Application Date: 2013-10-02
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Publication No.: US09219517B2Publication Date: 2015-12-22
- Inventor: Robert Aigner , Alireza Tajic
- Applicant: TriQuint Semiconductor, Inc.
- Applicant Address: US OR Hillsboro
- Assignee: TriQuint Semiconductor, Inc.
- Current Assignee: TriQuint Semiconductor, Inc.
- Current Assignee Address: US OR Hillsboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H03H9/17
- IPC: H03H9/17 ; H01L41/22 ; H04B1/40 ; H03H3/02 ; H03H9/02
Abstract:
Embodiments of apparatuses, systems and methods relating to temperature compensated bulk acoustic wave devices. In some embodiments, temperature compensated bulk acoustic wave devices are described with an over-moded reflector layer.
Public/Granted literature
- US20150094000A1 Temperature Compensated Bulk Acoustic Wave Devices Using Over-Moded Acoustic Reflector Layers Public/Granted day:2015-04-02
Information query
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