Invention Grant
- Patent Title: Array substrate and panel
- Patent Title (中): 阵列基板和面板
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Application No.: US14090889Application Date: 2013-11-26
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Publication No.: US09220161B2Publication Date: 2015-12-22
- Inventor: Lipeng Zheng
- Applicant: Shanghai Tianma Micro-Electronics Co., Ltd. , Tianma Micro-Electronics Co., Ltd.
- Applicant Address: CN Shanghai CN Shenzhen
- Assignee: Shanghai Tianma Micro-Electronics Co., Ltd.,Tianma Micro-Electronics Co., Ltd.
- Current Assignee: Shanghai Tianma Micro-Electronics Co., Ltd.,Tianma Micro-Electronics Co., Ltd.
- Current Assignee Address: CN Shanghai CN Shenzhen
- Agency: Alston & Bird LLP
- Priority: CN201310057816 20130222
- Main IPC: H02H9/00
- IPC: H02H9/00 ; H05F3/02 ; G02F1/1362 ; H01L27/02 ; H01L27/12

Abstract:
An array substrate includes a common electrode line located in a surrounding region, a protected structure located inside the common electrode line, and a first electrostatic protection circuit having a shorting bar electrically connected between the protected structure and the common electrode line for releasing static electricity on the protected structure. A second electrostatic protection circuit is also electrically connected between the protected structure and the common electrode line, and the second electrostatic protection circuit releases static electricity through the common electrode line after the shorting bar is cut off. The invention can make the conduction of the static electricity accumulated at the shorting bar that has been cut off change from unidirectional conduction toward inside of the array substrate to bidirectional conduction toward inside of the array substrate and edges of the array substrate, thus reducing the probability of electrostatic damage to internal devices of the array substrate.
Public/Granted literature
- US20140240889A1 ARRAY SUBSTRATE AND PANEL Public/Granted day:2014-08-28
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