Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US13398784Application Date: 2012-02-16
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Publication No.: US09220165B2Publication Date: 2015-12-22
- Inventor: Seiji Hayashi
- Applicant: Seiji Hayashi
- Applicant Address: JP Tokyo
- Assignee: CANON KAUBSHIKI KAISHA
- Current Assignee: CANON KAUBSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2007-160907 20070619; JP2008-118808 20080430
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14 ; H05K1/02

Abstract:
A power source terminal and a ground terminal for a semiconductor integrated circuit are connected to a conductor pattern through a capacitor. The conductor pattern is connected, through a filter, to a plane conductor connected to neither a ground plane nor a power source plane. Thus, a common mode noise arising from between the power source and the ground is caused to flow into the plane conductor. This reduces the common mode noise flowing in the ground and the power source of the printed wiring board, which relatively act as antennas.
Public/Granted literature
- US20120147580A1 PRINTED CIRCUIT BOARD Public/Granted day:2012-06-14
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