Invention Grant
- Patent Title: Biocompatible electroplated interconnection electronics package suitable for implantation
- Patent Title (中): 生物相容性电镀互连电子封装适合植入
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Application No.: US11821327Application Date: 2007-06-21
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Publication No.: US09220169B2Publication Date: 2015-12-22
- Inventor: Dao Min Zhou , James Singleton Little , Robert J. Greenberg
- Applicant: Dao Min Zhou , James Singleton Little , Robert J. Greenberg
- Applicant Address: US CA Sylmar
- Assignee: Second Sight Medical Products, Inc.
- Current Assignee: Second Sight Medical Products, Inc.
- Current Assignee Address: US CA Sylmar
- Agent Scott B. Dunbar; Gary Schnittgrund
- Main IPC: A61N1/36
- IPC: A61N1/36 ; H05K3/36 ; A61N1/02 ; C25D3/62 ; C25D5/02 ; C25D5/18 ; C25D5/56 ; H05K3/32 ; C25D3/56

Abstract:
Device is a hermetically sealed electronics package bonded to an electrode or flexible circuit that is suitable for implantation such as for a retinal or cortical electrode array. The hermetically sealed electronics package is bonded to the electrode or flexible circuit by electroplating a biocompatible material, such as platinum or gold, forming a plated connection, bonding the flexible circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation. The device comprises a substrate containing a contact, a flexible assembly containing a pad, and electroplated bonding between said contact and said pad that bonds said substrate and said flexible assembly together.
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